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datashee t product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/29 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 led driver with i 2 c compatible and 3-wire serial interface for 816 leds in dot matrix bu16501ks2 general description bu16501ks2 is ?matrix led driver? that is the most suitable for home appliance. it can control 8x16 (128 dot) led matrix by internal 8-channel pmos sws and 16-channel led drivers. it can control the brightness in each dot by the setting of the internal register. it supports spi and i 2 c interface. features ? led matrix driver (8x16) ? it has 8-channel pmos sws and 16-channel current drivers with 1/8 tdm timing driven sequentially. ? put on/off (for every dot) ? the current drivers can drive from 0 to 20.00ma current with ?16? steps(for every dot) ? the current drivers can drive maximum 42.5ma/line (iset=47k ? ) ? 64 steps of the luminance control by pwm (common setting for all dots) ? interface ? spi and i 2 c bus fs mode (max 400 khz) compability. ? for i 2 c mode, i 2 c device address is selectable (74h or 75h). ? thermal shutdown pin plan key specifications ? operating power supply voltage range: 2.7v to 5.5v ? oscillator frequency: 1.2mhz (typ.) ? operating temperature range: -40 to +85 package w(typ) x d(typ) x h(max) applications mobile phone, portable device, home electrical appliance, and general consumer equipment. device provided with led display application. led display. amusement, traffic signboards, hobby, etc. gnd4 test1 n.c. led16 led15 led14 ledgnd2 led13 led12 led11 led10 vbat1 gnd5 14 26 clkio sync vbat2 vbat3 ifmode gnd2 resetb vio scl gnd3 ce sda testo sw1 sw2 sw3 vinsw sw4 sw5 sw6 sw7 n.c. sw8 iset led9 led8 led7 led6 led5 ledgnd3 n.c. led4 led3 led2 led1 n.c. 1 13 40 52 ledgnd1 vinsw gnd1 27 39 sqfp-t52m 12.00mm x 12.00mm x 1.60mm
2/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 typical application circuit iset led1 led2 led3 led4 led5 led6 led8 led9 led10 led11 led13 led12 led7 led14 led15 led16 sw1 sw2 sw3 sw4 sw5 sw6 sw7 10 f 816 dot matrix unit 100k ? test1 resetb ce sda scl ifmode sync clkio i2c or spi selectable vio 1f gnd1 gnd2 gnd3 gnd4 testo ledgnd1 ledgnd vinsw vbat2 10 f vbat vinsw1 vbat1 matrix direction y x vinsw2 sw8 ledgnd vbat3 gnd5 bu16501ks2
3/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 pin descriptions no pin name i/o pull down unused processing setting esd diode functions equivalent circuit for power for ground 1 ledgnd1 - - - vbat - ground b 2 sw1 o - vinsw vinsw gnd p-mos sw1 output c 3 sw2 o - vinsw vinsw gnd p-mos sw2 output c 4 sw3 o - vinsw vinsw gnd p-mos sw3 output c 5 vinsw1 - - - - gnd power supply for sw1-8 a 6 vinsw2 - - - - gnd power supply for sw1-8 a 7 sw4 o - vinsw vinsw gnd p-mos sw4 output c 8 sw5 o - vinsw vinsw gnd p-mos sw5 output c 9 sw6 o - vinsw vinsw gnd p-mos sw6 output c 10 sw7 o - vinsw vinsw gnd p-mos sw7 output c 11 sw8 o - vinsw vinsw gnd p-mos sw8 output c 12 nc - - - - - - - 13 gnd1 - - - vbat - ground b 14 sync i - gnd vbat gnd external synchronous input pin d 15 vbat2 - - - - gnd battery is connected a 16 vbat3 - - - gnd battery is connected a 17 ifmode i - gnd vbat gnd i 2 c/spi select pin (l: i 2 c, h: spi) d 18 gnd2 - - - vbat - ground b 19 resetb i - gnd vbat gnd reset input pin (l: reset, h: reset cancel) d 20 vio - - - vbat gnd i/o power supply is connected i 21 scl i - - vbat gnd spi, i 2 c clk input pin d 22 gnd3 - - - vbat - ground b 23 ce i - gnd vbat gnd spi enable pin(h;enable), or i 2 c slave address selection (l: 74 , h: 75 ) d 24 sda i/o - - vbat gnd spi data input / i 2 c data input-output pin f 25 testo o - open vbat gnd test output pin1 g 26 clkio i/o 500 ? open vbat gnd reference clk input / output pin m 27 test1 i 94k ? gnd vbat gnd test input pin 1 e 28 nc - - - - - - - 29 led16 o - gnd - gnd led16 driver output k 30 led15 o - gnd - gnd led15 driver output k 31 led14 o - gnd - gnd led14 driver output k 32 ledgnd2 - - - vbat - ground b 33 led13 o - gnd - gnd led13 driver output k 34 led12 o - gnd - gnd led12 driver output k 35 led11 o - gnd - gnd led11 driver output k 36 led10 o - gnd - gnd led10 driver output k 37 vbat1 - - - - gnd battery is connected a 38 gnd4 - - - vbat - ground b 39 gnd5 - - - vbat - ground b 40 nc - - - - - - - 41 iset i - - vbat gnd led constant current driver current setting pin j 42 led9 o - gnd - gnd led9 driver output k 43 led8 o - gnd - gnd led8 driver output k 44 led7 o - gnd - gnd led7 driver output k 45 led6 o - gnd - gnd led6 driver output k 46 led5 o - gnd - gnd led5 driver output k 47 ledgnd3 - - - vbat - ground b 48 nc - - - - - - - 49 led4 o - gnd - gnd led4 driver output k 50 led3 o - gnd - gnd led3 driver output k 51 led2 o - gnd - gnd led2 driver output k 52 led1 o - gnd - gnd led1 driver output k
4/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 pin esd type vbat b vio vbat d vbat j vinsw c vinsw vio vbat e vio vbat f vbat h k a vbat i vio vbat m vio vbat g vio figure 1. pin esd type
5/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 absolute maximum ratings (ta=25 ) parameter symbol limits unit terminal voltage vmax -0.3 to +7 v power dissipation (note1) pd 1.30 w operating temperature ra nge topr -40 to +85 storage temperature range tstg -55 to +125 (note1) power dissipation deleting is 13mw/c, when it?s used in over 25c (rohm?s standard one layer board has been mounted.) the power dissipation of the ic has to be less than the one of the package. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is import ant to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating ratings (ta=-40 to 85 ) parameter symbol limits unit vbat input voltage vbat 2.7 to 5.5 v vinsw input voltage vinsw 2.7 to 5.5 v vio pin voltage vio 1.65 to 5.5 v electrical characteristics (unless otherwise specified, ta=25 , vbat=5.0v, vinsw=5.0v, vio=5.0v) parameter symbol limit unit condition min typ max [ circuit current ] vbat circuit current 1 ibat1 - 0 3.0 a resetb=0v, vio=0v vbat circuit current 2 ibat2 - 0.7 5.0 a resetb=0v, vio=5.0v vbat circuit current 3 ibat3 - 2.1 3.5 ma when led1-16 are active with 10.67ma settings. [ uvlo ] uvlo threshold vuvlo - 2.1 2.5 v vbat falling uvlo hysteresis vhyuvlo 50 - - mv [ led driver ] (led1-16) maximum output current iledmax1 - 20.00 - ma led1-16 ,iset 100k ? iledmax2 - 42.50 - ma led1-16 ,iset 47k ? output current iled -7.0 - +7.0 % i=10.67ma setting, vled=1v iset=100k ? led current matching iledmt - - 5 % iledmt= (iledmax-iledmin)/(iledmax+iledmin) i=10.67ma setting, vled=1v, iset=100k ? driver pin voltage range vled1 0.2 - vbat - 1.4 v led1-16 ,iset 100k ? led off leak current ilkled - - 1.0 a [ pmos switch ] leak current at off ileakp - - 1.0 a resistor at on ronp - 1.0 - ? isw=160ma, vinsw=5.0v [ osc ] osc frequency fosc 0.96 1.2 1.44 mhz [ ce, sync, ifmode ] l level input voltage vil1 -0.3 - 0.25 x vio v h level input voltage vih1 0.75 x vio - vio +0.3 v input current iin1 - 0 1 a input voltage = from (0.1 x vio) to (0.9 x vio)
6/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 electrical characteristics - continued parameter symbol limit unit condition min typ max [ sda, scl ] l level input voltage vil2 -0.3 - 0.25vio v h level input voltage vih2 0.75vio - vio+0.3 v input hysteresis vh ys 0.05vio - - v l level output voltage (for sda pin) vol2 - - 0.3 v iol=3ma input current iin2 -3 - 3 a input voltage = from (0.1 x vio) to (0.9 x vio) [ resetb ] l level input voltage vil3 -0.3 - 0.25vio v h level input voltage vih3 0.75vio - vio+0.3 v input current iin3 - 0 1 a input voltage = from (0.1 x vio) to (0.9 x vio) clkio(output) l level output voltage vol1 - - 0.4 v iol=2ma h level output voltage voh1 vio-0.4 - - v ioh=-2ma clkio(input) l level input voltage vil4 -0.3 - 0.25vio v h level input voltage vih4 0.75vio - vio+0.3 v input current iin4 - 10 20 a input voltage =5.0v (unless otherwise specified, ta=25 c, vbat=5.0v, vinsw=5.0v, vio=5.0v) parameter symbol limit unit condition min typ max scl cycle time tscyc 76 - - ns h period of scl cycle twhc 35 - - ns l period of scl cycle twlc 35 - - ns sda setup time tss 38 - - ns sda hold time tsh 38 - - ns write interval tc s w 38 - - ns write interval (after ram accsess) 2.1 - - s (n o t e 1) eclk x 2 - - s (note 2) ce setup time tcss 55 - - ns ce hold time tcgh 48 - - ns (note 1) when it used internal clock. (note 2) when it used external clock. (eclk means the cycle of external clock) (unless otherwise specified, ta=25 o c, vbat=5.0v, vinsw=5.0v, vio=5.0v) parameter symbol standard-mode fast-mode unit min typ max min typ max i 2 c bus format scl clock frequency f scl 0 - 100 0 - 400 khz low period of the scl clock t low 4.7 - - 1.3 - - s high period of the scl clock t high 4.0 - - 0.6 - - s hold time (repeated) start condition after this period, the first clock is generated t hd;sta 4.0 - - 0.6 - - s set-up time for a repeated start condition t su;sta 4.7 - - 0.6 - - s data hold time t hd;dat 0 - 3.45 0 - 0.9 s data set-up time t su;dat 250 - - 100 - - ns set-up time for stop condition t su;sto 4.0 - - 0.6 - - s bus free time between a stop and start condition t buf 4.7 - - 1.3 - - s
7/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 pwm led1 tdm tdm led2 tdm led3 tdm led4 tdm led5 tdm led6 tdm tdm led8 tdm led9 tdm led10 tdm led11 tdm tdm led13 led12 led7 tdm led14 tdm led15 tdm led16 sw1 t00 sw2 t01 sw3 t02 t03 t04 t05 t06 sw4 sw5 sw6 sw7 vref iref logic tdm iset max 42.5ma/ch 64 steps dc test1 resetb ce sd a scl ifmode sync clkio vio i/o spi / i 2 c interface digital control level shift gnd1 gnd2 gnd3 gnd4 testo ledgnd1 ledgnd2 osc vbat2 vinsw1 vbat1 vinsw2 t07 sw8 ledgnd3 vbat3 gnd5 block diagram
8/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 serial interface 1. spi format ? when ifmode is set to ?h?, it can interface with spi format. ? the serial interface is four terminals (serial clock terminal (scl), serial data input termi nal (sda), and chip selection input terminal (ce)). 1 write operation ? data is taken into an internal shift register with rising edge of scl. (max of the frequency is 13mhz.) ? the receive data becomes enable in t he ?h" section of ce. (active ?h".) ? the transmit data is forwarded (with msb-first) in the orde r of write command ?0?(1bit), the control register address (7bit) and data (8bit). figure 2. writing format 2 timing diagram figure 3. timing diagram (spi format) 2. i 2 c bus format when ifmode is set to ?l?, it can interface with i 2 c bus format. (1) slave address ce a7 a6 a5 a4 a3 a2 a1 r/w l 1 1 1 0 1 0 0 0 h 1 1 1 0 1 0 1 (2) bit transfer scl transfers 1-bit data during h. during h of scl, sda cannot be changed at the time of bit transfer. if sda changes while scl is h, start conditions or stop conditions will occur and it will be interpreted as a control signal. sda scl sda a state of stability data are effective sda it can change figure 4. bit transfer (i 2 c format) ce scl sda w a6 a5 a4 a3 a2 a1 a0 d4 d3 d2 d1 d0 d7 d6 d5 twlc ce scl sda tcsw twhc tcss tscyc tss tsh tcgh
9/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 serial interface - continued (3) start and stop condition when sda and scl are h, data is not transferred on the i 2 c- bus. this condition indicates, if sda changes from h to l while scl has been h, it will become start (s) conditions, and an access start, if sda changes from l to h while scl has been h, it will become stop (p) conditions and an access end. sda scl s p start condition stop condition figure 5. start/stop condition (i 2 c format) (4) acknowledge it transfers data 8 bits each after the occurrence of start condition. a transmitter opens sda after transfer 8bits data, and a receiver returns the acknowledge signal by setting sda to l. 12 89 data output by transmitter data output by receiver acknowledge not acknowledge s start condition clock pulse for acknowledgement scl figure 6. acknowledge (i 2 c format) (5) writing protocol a register address is transferred by the next 1 byte that transferred the slave address and the write-in command. the 3rd byte writes data in the internal register written in by the 2nd byte, and after 4th byte or, the increment of register address is carried out automatically. however, when a register address turns into the last address (40h), it is set to 00h by the next transmission. after the transmission end, the increment of the address is carried out. s a a a p register address slave address from master to slave from slave to master r/w=0(write) data a d7 d6 d5 d4 d3 d2 d1 d0 d7 d6 d5 d4 d3 d2 d1 d0 a 7 a 6 a 5 a 4 a 3 a 2 a 1 a 0 0 x x x x x x x *1 *1 data a =acknowledge(sd a low) a =not acknowledge(sda high) s=start condition p=stop condition *1: write timing register address increment register address increment (6) timing diagram sda s cl t su;dat t low s sr p s t buf t hd;sta t su;sta t high t hd;sta t hd;dat t su;sto figure 7. timing diagram ( i 2 c c format)
10/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 register list (note) please be sure to write ?0? in the register which is not assigned. it is prohibition to write data to the address which is not assigned. control register address default d7 d6 d5 d4 d3 d2 d1 d0 block remark 00h 00h - - - - - - - sftrst reset software reset 01h 00h - - - - oscen - - - osc osc on/off control 11h 00h led8on led7on led6on led5on led4on led3on led2on led1on led driver led1-8 enable 12h 00h led16on led15on led14on led13on led 12on led11on led10on led9on led9-16 enable 20h 00h - - pwmset[5:0] pwm led1-16 pwm setting 21h 00h clksel[1 0] - - syncact syncon clkout clkin clk clk selection, sync operation control 2dh 00h - - - - - pwmen - - matrix pwm on/off setting 30h 00h - - - - - - - start led matrix control 31h 00h - - - - - - - clra matrix data clear 7fh 00h - - - - - - - rmcg rmap resistor map change pattern register address default d7 d6 d5 d4 d3 d2 d1 d0 block r/w remark 01h 00h iled01set[3:0] iled00set[3:0] matrix data w data for matrix 01/00 02h 00h iled03set[3:0] iled02set[3:0] w data for matrix 03/02 03h 00h iled05set[3:0] iled04set[3:0] w data for matrix 05/04 04h 00h iled07set[3:0] iled06set[3:0] w data for matrix 07/06 05h 00h iled11set[3:0] iled10set[3:0] w data for matrix 11/10 06h 00h iled13set[3:0] iled12set[3:0] w data for matrix 13/12 07h 00h iled15set[3:0] iled14set[3:0] w data for matrix 15/14 08h 00h iled17set[3:0] iled16set[3:0] w data for matrix 17/16 09h 00h iled21set[3:0] iled20set[3:0] w data for matrix 21/20 0ah 00h iled23set[3:0] iled22set[3:0] w data for matrix 23/22 0bh 00h iled25set[3:0] iled24set[3:0] w data for matrix 25/24 0ch 00h iled27set[3:0] iled26set[3:0] w data for matrix 27/26 0dh 00h iled31set[3:0] iled30set[3:0] w data for matrix 31/30 0eh 00h iled33set[3:0] iled32set[3:0] w data for matrix 33/32 0fh 00h iled35set[3:0] iled34set[3:0] w data for matrix 35/34 10h 00h iled37set[3:0] iled36set[3:0] w data for matrix 37/36 11h 00h iled41set[3:0] iled40set[3:0] w data for matrix 41/40 12h 00h iled43set[3:0] iled42set[3:0] w data for matrix 43/42 13h 00h iled45set[3:0] iled44set[3:0] w data for matrix 45/44 14h 00h iled47set[3:0] iled46set[3:0] w data for matrix 47/46 15h 00h iled51set[3:0] iled50set[3:0] w data for matrix 51/50 16h 00h iled53set[3:0] iled52set[3:0] w data for matrix 53/52 17h 00h iled55set[3:0] iled54set[3:0] w data for matrix 55/54 18h 00h iled57set[3:0] iled56set[3:0] w data for matrix 57/56 19h 00h iled61set[3:0] iled60set[3:0] w data for matrix 61/60 1ah 00h iled63set[3:0] iled62set[3:0] w data for matrix 63/62 1bh 00h iled65set[3:0] iled64set[3:0] w data for matrix 65/64 1ch 00h iled67set[3:0] iled66set[3:0] w data for matrix 67/66 1dh 00h iled71set[3:0] iled70set[3:0] w data for matrix 71/70 1eh 00h iled73set[3:0] iled72set[3:0] w data for matrix 73/72 1fh 00h iled75set[3:0] iled74set[3:0] w data for matrix 75/74 20h 00h iled77set[3:0] iled76set[3:0] w data for matrix 77/76 21h 00h iled81set[3:0] iled80set[3:0] w data for matrix 81/80 22h 00h iled83set[3:0] iled82set[3:0] w data for matrix 83/82 23h 00h iled85set[3:0] iled84set[3:0] w data for matrix 85/84 24h 00h iled87set[3:0] iled86set[3:0] w data for matrix 87/86 25h 00h iled91set[3:0] iled90set[3:0] w data for matrix 91/90 26h 00h iled93set[3:0] iled92set[3:0] w data for matrix 93/92 27h 00h iled95set[3:0] iled94set[3:0] w data for matrix 95/94 28h 00h iled97set[3:0] iled96set[3:0] w data for matrix 97/96 29h 00h ileda1set[3:0] ileda0set[3:0] w data for matrix a1/a0 2ah 00h ileda3set[3:0] ileda2set[3:0] w data for matrix a3/a2 2bh 00h ileda5set[3:0] ileda4set[3:0] w data for matrix a5/a4 2ch 00h ileda7set[3:0] ileda6set[3:0] w data for matrix a7/a6 2dh 00h iledb1set[3:0] iledb0set[3:0] w data for matrix b1/b0 2eh 00h iledb3set[3:0] iledb2set[3:0] w data for matrix b3/b2 2fh 00h iledb5set[3:0] iledb4set[3:0] w data for matrix b5/b4
11/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 pattern register - continued address default d7 d6 d5 d4 d3 d2 d1 d0 block r/w remark 30h 00h iledb7set[3:0] iledb6set[3:0] matrix data w data for matrix b7/b6 31h 00h iledc1set[3:0] iledc0set[3:0] w data for matrix c1/c0 32h 00h iledc3set[3:0] iledc2set[3:0] w data for matrix c3/c2 33h 00h iledc5set[3:0] iledc4set[3:0] w data for matrix c5/c4 34h 00h iledc7set[3:0] iledc6set[3:0] w data for matrix c7/c6 35h 00h iledd1set[3:0] iledd0set[3:0] w data for matrix d1/d0 36h 00h iledd3set[3:0] iledd2set[3:0] w data for matrix d3/d2 37h 00h iledd5set[3:0] iledd4set[3:0] w data for matrix d5/d4 38h 00h iledd7set[3:0] iledd6set[3:0] w data for matrix d7/d6 39h 00h ilede1set[3:0] ilede0set[3:0] w data for matrix e1/e0 3ah 00h ilede3set[3:0] ilede2set[3:0] w data for matrix e3/e2 3bh 00h ilede5set[3:0] ilede4set[3:0] w data for matrix e5/e4 3ch 00h ilede7set[3:0] ilede6set[3:0] w data for matrix e7/e6 3dh 00h iledf1set[3:0] iledf0set[3 :0] w data for matrix f1/f0 3eh 00h iledf3set[3:0] iledf2set[3:0] w data for matrix f3/f2 3fh 00h iledf5set[3:0] iledf4set[3:0] w data for matrix f5/f4 40h 00h iledf7set[3:0] iledf6set[3:0] w data for matrix f7/f6 register map address 00h < software reset > address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 00h w - - - - - - - sftrst initial value 00h - - - - - - - 0 bit 0 sftrst software reset ?0? : reset cancel ?1? : reset all register initializing sftrst register return to 0 automatically. address 01h address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 01h w - - - - oscen - - - initial value 00h - - - - 0 - - - bit 3 oscen osc block on/off control ?0? off initial ?1? on this register should not change into "1 " " 0" at the time of start (30h, d0) register ="1" setup (under lighting operation). this register must be set to "0" after led putting out lights ("start register = 0"), and please surely stop an internal oscillation circuit.
12/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 register map - continued address 11h < led1-8 enable > address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 11h w led8on led7on led6on led5on led4on led3on led2on led1on initial value 00h 0 0 0 0 0 0 0 0 bit 0 led1on led1 on/off setting ?0? led1 off initial ?1? led1 on bit 1 led2on led2 on/off setting ?0? led2 off initial ?1? led2 on bit 2 led3on led3 on/off setting ?0? led3 off initial ?1? led3 on bit 3 led4on led4 on/off setting ?0? led4 off initial ?1? led4 on bit 4 led5on led5 on/off setting ?0? led5 off initial ?1? led5 on bit 5 led6on led6 on/off setting ?0? led6 off initial ?1? led6 on bit 6 led7on led7 on/off setting ?0? led7 off initial ?1? led7 on bit 7 led8on led8 on/off setting ?0? led8 off initial ?1? led8 on (note) current setting foll ows iledxxset[3:0] register.
13/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 register map - continued address 12h < led9-16 enable > address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 12h w led16 on led15 on led14 on led13 on led12 on led11 on led10 on led9 on initial value 00h 0 0 0 0 0 0 0 0 bit 0 led9on led9 on/off setting ?0? led9 off initial ?1? led9 on bit 1 led10on led10 on/off setting ?0? led10 off initial ?1? led10 on bit 2 led11on led11 on/off setting ?0? led11 off initial ?1? led11 on bit 3 led12on led12 on/off setting ?0? led12 off initial ?1? led12 on bit 4 led13on led13 on/off setting ?0? led13 off initial ?1? led13 on bit 5 led14on led14 on/off setting ?0? led14 off initial ?1? led14 on bit 6 led15on led15 on/off setting ?0? led15 off initial ?1? led15 on bit 7 led16on led16 on/off setting ?0? led16 off initial ?1? led16 on (note) current setting foll ows iledxxset[3:0] register.
14/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 register map - continued address 20h < led1-16 pwm setting > address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 20h w - - pwmset [5:0] initial value 00h - - 0 0 0 0 0 0 bit 5-0 pwmset[5:0] led1-16 pwm duty setting ?000000? 0/63 0%(initial) ?000001? 1/63 1.59% ?100000? 32/63 50.8% ?111110? 62/63 98.4% ?111111? 63/63 100% (note)please refer to description of operation, chapter 2 address 21h address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 21h w clksel[1:0] - - syncact syncon clkout clkin initial value 00h 0 0 - - 0 0 0 0 bit 0 clkin selection clk for pwm control ?0? internal osc (initial) ?1? external clk input (to clkio pin) bit 1 clkout output clk enable ?0? clk is not output (initial) ?1? output selected clk from clkio pin as for clkin & clkout, setting change is forbidden under oscen (01h, d3) register =?1? and also under clock input to clkio terminal. bit 2 syncon sync operation enable ?0? disable sync operation (initial) ?1? sync pin control led driver on/off bit 3 syncact sync operation setting ?0? when sync pin is ?l?, led drivers are on (initial) ?1? when sync pin is ?h?, led drivers are on bit 7-6 clksel[1:0] select clock frequency ?00? 1.2mhz (initial) ?01? 300khz ?10? 150khz ?11? 37.5khz
15/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 register map - continued address 2dh < pwm on/off setting > address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 2dh w - - - - - pwmen - - initial value 00h - - - - - 0 - - bit 2 pwmen pwm control at led1-16 on/off setting ?0? pwm operation is invalid initial value ?1? pwm operation is valid (note)please refer to description of operation, chapter 2 address 30h < led matrix control > address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 30h w - - - - - - - start initial value 00h - - - - - - - 0 bit 0 start lighting/turning off bit of matrix led(led1-16) ?0? matrix led led1-16 lights out (initial) ?1? matrix led led1-16 lighting start address 31h < matrix data clear > address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 31h w - - - - - - - clra initial value 00h - - - - - - - 0 bit 0 clra reset pattern register ?0? pattern register is not reset and writable initial value ?1? pattern register is reset (note)clra register return to 0 automatically. address 7fh < register map change > address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 7fh w - - - - - - - rmcg initial value 00h - - - - - - - 0 bit 0 rmcg change register map ?0? control register is selected initial value ?1? pattern register is selected
16/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 register map - continued address 01h-40h < pattern register data > address (index) r/w bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 01-40h w iledxxset [3 :0] iledxxset [3:0] initial value 00h 0 0 0 0 0 0 0 0 bit7-4/bit 3-0 iledxxset[3:0] led output current setting for pattern matrix data iledxxset[3:0] 0 0 0 0 0 [ma] 0 0 0 1 1/15 x iledmax [ma] 0 0 1 0 2/15 x iledmax [ma] ? ? ? ? 1/15 x iledmax [ma] step ? ? ? ? ? ? ? ? ? ? ? ? 1 1 0 1 13/15 x iledmax [ma] 1 1 1 0 14/15 x iledmax [ma] 1 1 1 1 15/15 x iledmax [ma] example : iledmax=20ma (iset=100 k ? ) , led current setting as below. ?0000? 0.00ma ?0001? 1.33ma ?0010? 2.67ma ?0011? 4.00ma ?0100? 5.33ma ?0101? 6.67ma ?0110? 8.00ma ?0111? 9.33ma ?1000? 10.67ma initial value ?1001? 12.00ma ?1010? 13.33ma ?1011? 14.67ma ?1100? 16.00ma ?1101? 17.33ma ?1110? 18.67ma ?1111? 20.00ma (note) in a spi interface, the interval to the following access has regulation after this address access. for details, please refer to the clause of the chapter of serial interface, and the electrical property of a spi format. (note) the change of this register needs osc frequency or clkio external input frequency. please set "address 01h" or "address 21h" before the change of this register.
17/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 description of operation 1. led matrix 1-1. lighting method of dot matrix it can control 8 x 16 matrix. figure 8. 8 x 16 led matrix coordinate the sw1 ? sw8 is turned on by serial. led is driven one by one within the on period. figure 9. sw timing sw4 sw2 sw5 sw3 sw1 1/8tdma period 559clk @1.2mhz 465.8us sw6 sw7 led1 pwm period 524clk @1.2mhz 436.7us duty is variable 0/63 and between 1/63 and 63/63 of pwm period. df0 df6 df7 led16 df5 df4 df3 df2 df1 d00 d06 d07 d05 d04 d03 d02 d01 n5n5n5n5n5 tdma period 4472clk @1.2mhz 3.73ms df1 df0 d01 d00 sw8 00 10 20 30 40 50 60 70 80 90 a0 b0 c0 d0 e0 f0 01 11 21 31 41 51 61 71 81 91 a1 b1 c1 d1 e1 f1 02 12 22 32 42 52 62 72 82 92 a2 b2 c2 d2 e2 f2 03 13 23 33 43 53 63 73 83 93 a3 b3 c3 d3 e3 f3 04 14 24 34 44 54 64 74 84 94 a4 b4 c4 d4 e4 f4 05 15 25 35 45 55 65 75 85 95 a5 b5 c5 d5 e5 f5 06 16 26 36 46 56 66 76 86 96 a6 b6 c6 d6 e6 f6 07 17 27 37 47 57 67 77 87 97 a7 b7 c7 d7 e7 f7 vinsw tdm led1 tdm led2 sw 1 t00 sw 2 t01 sw 3 t02 sw 4 t03 sw 5 t04 tdm led3 tdm led4 tdm led5 tdm led6 tdm led7 tdm led8 tdm led9 tdm led10 tdm led11 tdm led12 tdm led13 tdm led14 tdm led15 tdm led16 matrix direction y x sw 8 t 07 sw 7 t 06 sw 6 t05
18/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 description of operation - continued 1-2. led lighting example the following command set is the example of led matrix lighting. 1) 7fh 00000000 select control register 2) 21h 00000000 select internal osc for clk 3) 01h 00001000 start osc 4) 11h 11111111 set led1-8 enable 5) 12h 11 111111 set led9-16 e nable 6) 20h 00111111 set max duty at slop set max duty 7) 7fh 00000001 select pattern register to write matrix data 8) 01-40h xxxxxxxx write pattern data 9) 7fh 00000000 select control register, pattern register to output for matrix 10) 30h 00000001 start lighting 11) 30h 00000000 light off 2. led driver current control it can be controlled pwm duty and dc current for led driver current. item control object control detail setting registers name (n ote 1 ) bits (a) (n o t e 2 ) pwm duty whole matrix 0/63 to 63/63 (64 step) pwmset 6 (b) (n o t e 3 ) dc current each matrix dot 0 to 20.00ma (16 step) iledxxset 4 (note1) the ?xx? shows the matrix number from ?00? to ?f7?. please refer 8x16 led matrix coordinate. (note2) for setting(a), please refer to p14 :register map of address 20h. (note3) for setting(b), please refer to p16 :register map of address 01h-40h. ~ 559clk = 1/8tdma ~ ~ (a) pwm duty minimum width=5clk ~ duty is variable by pwmset[5 0] between 0/63 and 63/63. duty 1/63=8clk clk (ex.1.2mhz at internal osc) off led driver internal enable signal figure 10. led output current timing and pwm cycle 524clk of pwm period is set in the 1/8 tdm period (559clk). pwm is operated 63 steps of 8clk. tdm period is 3.73ms (@1.2mhz). moreover, it has the starting waiting time of a constant current driver by 20clk. pwm"h" time turns into on time after waiting 20clk. (however, led driver is set ?off? compulsorily at pwm=0% setting.) figure 11. led output current timing and a pwm cycle pwm = 0/63 setting 0ma pwm = 1/63 setting 20clk 1/63 = 8clk 20clk 2/63 = 16clk pwm = 2/63 setting off led drive internal enable signal 20clk wait
19/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 description of operation - continued 3. about ledmax current setting led current is variable by riset resister connecting iset terminal. maximum led current can be leads by next formula. i ledmax [a] = 2.0 / r iset [k ? ] (typ) caution that maximum led current value is up to 42.5ma. 0 10 20 30 40 50 60 0 50 100 150 200 250 300 350 400 450 500 figure 12. iled vs riset in case of riset = 100[k ? ], maximum led current is 20.0ma. there are maximum led current and delta led current value in next table. if you change the riset value, you can calculate led current on each step by next table. recommended riset value is 100[k ? ]. in case of riset under 47.5 [k ? ], iset short function may be effective. an example for setting dc current=16ma , pwmduty=50.8% 1. iledmax current setting (set by external resistor): riset=100k ? -> iledmax[a]= 2.0 / r iset [k ? ]=20ma. 2. dc current setting (set by register/each matrix dot can be set): iledxxset[3:0]=?1100? -> iledxx[a]=12/15 * iledmax=16ma. please refer to p16 to set register of address01h-40h. 3. pwm duty setting (set by register /whole matrix): pwmset[5:0]=?100000? (50.8%) -> iledxx[a]=16ma * 50.8%=8.128ma. please refer to p14 to set register of address20h. 4. 1/8tdm active -> iledxx[a]=8.128ma * 1/8=1.016ma. for this case, average 1.016ma led current is loaded to one led. prohibit setting area (under 47.5k ? ) riset [k ? ] iled [ma]
20/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 description of operation - continued 4. power up sequence command v io resetb vbat t vioon =min 0.5ms t rstb =min 0.1ms possible t rst =min 0ms t viooff =min 1ms vinsw t vinswon =min 0ms t vbaton =min 0ms t vbatoff2 =min 0ms t vinswoff =min 0.1ms inhibit inhibit 2.5v 2.5v 1.55v 0.4v figure 13. power up sequence please take sufficient wait time for each power/control signal. however, if vbat<2.1v(typ) or ta >t tsd (typ:175 ), the command input is not effectiv e because of the protection operation 5. reset there are two kinds of reset, software reset and hardware reset (1) software reset ? all the registers are initialized by sftrst="1". ? sftrst is an automatically returned to "0". (auto return 0). (2) hardware reset ? it shifts to hardware reset by changing resetb pin ?h? ?l?. ? the condition of all the registers under hardware reset pin is returned to the initial value, and it stops accepting all address. all led driver turn off. ? it?s possible to release from a state of hardware reset by changing resetb pin ?l? ?h?. resetb pin has delay circuit. lt doesn?t recognize as hardware reset in "l" period under 5 s. 6. thermal shutdown a thermal shutdown function is effective at all blocks of those other than vref. return to the state before detection automatically at the time of release. 7. uvlo function (vbat voltage low-voltage detection) uvlo function is effective at all blocks of those other than vref, and when detected, those blocks function is stopped. return to the state before detection automatically at the time of release.
21/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 description of operation - continued 8. i/o when the resetb pin is low, the input buffers (sda and scl) are disabling for the low consumption power. figure 14. input disabling by resetb 9. standard clock input and output it is possible to carry out synchronous operation of two or more ics using the input-and-output function of a standard clock. figure 15. i/o part equivalent circuit diagram ? when a clock is supplied from the exterior inputting an external standard clock from clkin and setting register clkin=1, ic operates with the clock inputted from clkin as a standard clock. ? when the built-in oscillation circuit of one ic is used when a clock cannot be supplied from the exterior, it is possible to synchronize between ics by the connection as the following figure. figure 16. it is an example of application for the usage of two or more. se l regi st er : clkout sync clki o register: syncon register : clkin tdma controller osc pmos swi tch led dri ver led matrix level shift vbat scl (sda) resetb logic vio en resetb=l, output ?h? osc clkio ic1 osc clkio ic2 osc clkio ic3 when a clock supplied from ic1
22/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 description of operation - continued 10. external on/off synchronization (sync terminal) lighting of led that synchronized with the external signal is possible. by setting h/l of sync terminal, led drivers output is set on/off. it?s asynchronous operation with the internal tdma control. figure 17. i/o part equivalent circuit diagram 11. about terminal processing of the function which is not used please set up a test terminal and the unused terminal as the following table. especially, if an input terminal is not fixed, it may occu r the unstable state of a device and the unexpected internal current. terminal name processing reason sync gnd short in order to avoid an unfixed state. clkio open pin is fixed to l because pin is connected with a pull down register of 500kohm test1 gnd short the input terminal for a test (94k ? pull down) testo open the output terminal for a test led terminal gnd short in order to avoid an unfixed state. (register setup in connection with led terminal that is not used is forbidden.) sw terminal vinsw short in order to avoid an unfixed state. (register setup in connection with sw terminal that is not used is forbidden.) se l register : clkout sync clkio register : syncon register : clkin tdma controller osc pmos swi tch led dri ver led matrix
23/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 description of operation - continued 12. setting about vinsw vinsw is power supply about led current. it needs proper voltage range of led terminal to get proper led current (refer to page5). if it needs the voltage range, it needs to set up proper voltage range of vinsw which is power supply about led. figure 18. set up vinsw figure 19. sw timing and iout vinsw?s voltage range is made by v1, v2, v3. (refer to figure 18) vinsw_max = v1_min + v2_min + v3_max vinsw_min = v1_max + v2_max + v3_min v1:ir drop voltage v1 is ir voltage drop by sw?s resistor at on and iout which is the sum of every led current. it is v1?s maximum and minimum that it multiplies by sw?s resistor at on and iout maximum and minimum in each sw timing. please estimate iout by setting application. (refer to figure 19). please refer to page 5 about sw?s resistor at on. (and it needs to estimate parasitic resistor on pcb?s current route). v1_max = ron * iout_max v1_min = ron * iout_min v2: led vf v2 is the voltage drop by led?s vf. please confirm about all led?s vf. v2_max = vf_max v2_min = vf_min v3: terminal voltage to operate v3 is the terminal voltage to operate led current. (refer to page 5). the minimum is made by ic?s ability. the maximum is made by vbat?s minimum in voltage range. v3_max = vbat_min ? 1.4v v3_min = 0.2v --example of setting vinsw? condition: vbat=3.2 ? 4.0 v, iout_max = 100ma, iout_min = 20ma, vf_max = 3.0v, vf_min = 2.5v v1_max = 1 ohm * 100ma = 0.1v v1_min = 1 ohm * 20ma = 0.02v v2_max = 3.0v v2_min = 2.5v v3_max = 3.2v ? 1.4v = 1.8v v3_min = 0.2v vinsw_max = 0.02v + 2.5v + 1.8v = 4.32v vinsw_min = 0.1v + 3.0v + 0.2v =3.3v this is proper voltage range about vinsw. sw led1 vinsw v1: ? ir ? drop ? voltage v3: ? terminal ? voltage ? to ? operate v2: ? led ? vf iout led16 internal ? ic external ? ic vinsw ? = ? v1 ? + ? v2 ? + ? v3 sw1 sw2 sw3 sw4 sw5 iout ma on/off on/off on/off on/off on/off (unit) iout_max iout_min time iout ? = ? iled1 ? + ? iled2 ? + ? ************** ? + ? iled16
24/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 power dissipation (on the rohm?s standard one layer board) figure 20. power dissipation p d =(vinsw-v f ) x i led x n(channel) ex ) vinsw=5v, vf=3.2v, i led =20ma,n=16channel, p d =(5-3.2) x 20 x 16=576mw please adjust vinsw and i led in order to prevent p d from exceeding 1300mv of power dissipation. *vinsw: vinsw input voltage *v f : diode v f *i led : led current *n(channel): led channel 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 25 50 75 100 125 150 power dissipation pd w) ta ( ) 1300mw
25/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all powe r supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inrush current may flow instantaneously due to the internal pow ering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground t he ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
26/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 operational notes ? continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electr ic field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevit ably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the groun d voltage should be avoided. furthermore, do not apply a volt age to the input pins when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other than protecting the ic from heat damage.
27/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 ordering information b u 1 6 5 0 1 k s 2 - e 2 part number package ks2: sqfp-t52m packaging and forming specification e2: embossed tape and reel marking diagram sqfp-t52m (top view) bu16501ks2 part number marking lot number 1pin mark
28/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 physical dimensions tape and reel information sqfp-t52m
29/29 datasheet datasheet bu16501ks2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 tsz02201-0g3g0cz00250-1-2 01.oct.2013 rev.001 revision history date revision changes 01.oct.2013 001 new release
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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